Dettagli:
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Luogo di origine: | Zhuzhou |
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Marca: | Sanxin |
Certificazione: | ISO 9001:2015 |
Numero di modello: | SX1254 |
Termini di pagamento e spedizione:
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Quantità di ordine minimo: | 5 |
Tempi di consegna: | 5-25 giorni |
Termini di pagamento: | L/C, T/T, Western Union |
Informazioni dettagliate |
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Categorie: | Parti della muffa del carburo di tungsteno | Caratteristiche: | Alta resistenza all'usura, alta robustezza, alta resistenza |
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Tolleranza: | ± 0,01 mm | Finitura superficiale: | Polito |
Caratteristica: | Alta durezza | Dimensione: | Personalizzato |
Applicazione: | Parti lavorative di piccole dimensioni | Superficie: | Spazii in bianco o macinazione lucidata |
materiale: | Carburo di tungsteno | Industria: | Industria degli elettrodomestici |
Evidenziare: | Monolithic Tungsten Carbide Punch,Ultra-hard Core Tungsten Carbide Punch,Burr-free Tungsten Carbide Punch |
Descrizione di prodotto
Burr-free Monolithic Tungsten Carbide Punch for Ultra-hard Core Precision Drilling
Introduction:
Adopting a step punch with integral sintered tungsten carbide (WC ≥ 94%), with a hardness of 92.5HRA and nanoscale transition rounded corners (R0.03mm), it breaks through the fracture bottleneck of traditional splicing punches and achieves precise piercing without burrs for millions of times in micro scale stamping fields such as electronic connectors, medical catheters, and lead frames.
Component | Content (wt.%) | Tolerance |
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WC (Tungsten Carbide) | 94% | ±0.5% |
Co (Cobalt) | 6% | ±0.3% |
Impurities (Total) | ≤0.5% | - |
Process:
1. Nano powder step molding
- Isostatic pressing gradient density control (deviation <0.3%)
- Graphite mold accuracy ±1μm (to prevent step deformation)
2. Low pressure SPS synchronous sintering
- Multi-temperature zone precise temperature control (1200℃±3℃)
- Grain boundary diffusion inhibition
3. Pulse electrolysis sharp edge strengthening
- Step transition R angle mirror polishing (Ra 0.02μm)
- Edge residual compressive stress +350MPa (anti-cracking ↑200%)
Application:
1. Precision manufacturing of electronics
- Lead frame: 0.1mm step hole punching (burr <5μm)
- Type-C interface terminal: 0.25mm special-shaped multi-level punching (position accuracy ±2μm)
- PCB plug-in pin: step countersunk hole forming (taper 30°±0.5°)
2. Medical device processing
- Heart stent laser cutting template (0.08mm step hole array)
- Minimally invasive surgical forceps riveting hole (double-stage transition without burr)
- Insulin needle guide hole (Φ0.15mm step expansion hole)
3. Precision mechanical core
- Fuel nozzle micro-hole step forming (roundness error <1μm)
- Clock gear shaft hole fine punching (coaxiality 0.003mm)
- Optical fiber connector ceramic ferrule (multi-level countersunk hole processing)
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